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Resin.io Secures $9 Million in Funding to Accelerate Growth of Next Generation IoT DevOps Platform

Seattle, WA, June 27, 2016 — resin.io, provider of a modern DevOps management platform for connected devices, today announced that it has secured $9 million in funding from DFJ, GE Ventures, Ericsson, and Aspect Ventures. Resin.io was founded in 2013 with a mission to use linux containers and other open technologies to simplify the way developers build, deploy, and manage software for IoT devices. Since then, businesses across a range of vertical industries have adopted the resin.io platform to safely and iteratively deliver software over the air for security patches, new feature deployments and device configuration changes. The new round of funding will be used to expand the company’s product footprint, grow its open source community, and broaden its global reach through new strategic partnerships and channels.

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